Opis Two inspection machines for the semiconductor industry, specifically for PCB production, are available. 1) 3D solder paste inspection system Saki SPI-Spider, year of manufacture: 2007, inspection type: tomography, 2) automatic optical inspection system Saki AOI System BF-Frontier II, year of manufacture: 2008, resolution: 18µm, min. board dimensions X/Y: 60mm/50mm, max. board dimensions X/Y: 500mm/460mm, board warp: +/- 50mm. PCB dimensions X/Y: 500mm/460mm, PCB warp: +/-2mm, component clearance top/bottom: 40mm/40mm, rotation: 359°, transport height: 900mm, transport height adjustment: +/-20mm, machine dimensions X/Y/Z: approx. 850mm/1350mm/1250mm, weight: approx. 450kg. Documentation available. On-site inspection is possible. |
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Producent | Saki |
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Typ | Spider/BF-Frontier II |
Rok produkcji | 2008 |
Cena | Na zapytanie |
Nr. oferty | INNO29124 |
Aby wysłać formularz, prosimy aby go kompletnie wypełnić. Pryz okazji, na zapytania w języku Niemieckim lub Angielskim możemy syzbciej oodpowiadać.