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Innovac GmbH Used machines from Germany

i.e. Machining Center MORI SEIKI

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Assembly systems 2 Manipulators 7 Other machinery 6 Placement technology 42 Positioning systems 1 Sorting device 1 Steerings 4

Innovac used-machines

Placement technology [1 - 20 of 42]

Board Tester

Spea 3030 Inline

Germany

2023

used

on request

INNO29988

A fully automatic SPEA bed-of-nails in-circuit tester for SMEMA production lines is available. Type: inline ICT tester, slots: 2x768/Core, conveyor width range: 50mm-380mm, conveyor length: 450mm, resistance measurement range: 1mΩ-1GΩ, capacitance measurement range: 0.5pF-1F, inductance measurement range: 1µH-1H, dimensions X/Y/Z: approx. 900mm/1000mm/1750mm. Including various feeders (8x2-56). Documentation available. An on-site inspection is possible.

Wave Soldering System

Seho 8040 PCS

Germany

1997

used

on request

INNO29826

Seho 8040 PCS with laminar and turbulent wave, preheating with heating plates and IR radiator, minimum quantity flux system, component cooler at the outlet, wave width: 400mm, max. usable working width: 390mm, max. component height: 100mm, max. PCB length: 562mm, solder nozzle: Delta B, max. wave height: 8mm, solder volume: 400kg, heating capacity solder pot: 9kW, heating-up time 20-250°C: approx. 150min, heating-up time 190-250°C: approx. 60min, preheating zone length: 700mm, three heating zones: 3x 3kW, max. preheating capacity: 9kW, transport angle: manually adjustable, 6-8°, transport speed: 0.5-2m/min, running direction: from left to right, with loading aid/slide conveyor (1000mm), unloading aid (500mm) and entry stopper for solder frame separation, exhaust connection diameter: 2x 150mm, extraction capacity per connection: 500m³/h, supply voltage (50Hz): 230/400V, rated power: 31,000W, total connected load: 18.5kW, compressed air connection: R 1/4 inch (6 bar), nitrogen connection: R 1/4 inch (6 bar). With microprocessor control PCS 96, alphanumeric display & membrane keypad (16 lines of 40 characters), 100 soldering programs, interface for host computer with visualized machine overview & BDE data backup, interface for BDE data acquisition via serial printer, control loop for transport and heating. Length: 2300mm, width: 825mm, height: 1615mm, weight without solder filling: 400kg.

Placement System

Essemtec FLX2011-LV

Germany

unknown

used

on request

INNO29787

An SMT pick-and-place system that can be used as a standalone or inline machine. With single head with laser centring, upward-facing camera and display. Voltage: 230V, the machine has been regularly serviced, with accessories. On-site viewing is possible.

Buffering Module

Asys FPS 10B SPI

Germany

2017

used

on request

INNO29535

Transport height range: 800mm-1000mm, buffer capacity: 10 blanks, blank length range: 70mm-460mm, blank width range: 50mm-460mm, blank thickness range: 0.3mm-3mm, max. individual blank weight: 2kg, max. total blank weight: 20kg, cycle time (FIFO): less than 15s. Machine dimensions X/Y/Z: approx. 1150mm/1400mm/1550mm, weight: approx. 400kg. Documentation available. On-site inspection is possible.

Stencil Printer

Panasonic SP18

Germany

2011

used

on request

INNO29532

Cycle time: 8s+printing time, min. PCB dimensions X/Y: 50mm/50mm, max. PCB dimensions X/Y: 510mm/460mm, repeat accuracy: 12.5µm, screen printing frame: 550mm/650mm-736mm/736mm, printing capacity: 450 pieces/h, machine dimensions X/Y/Z: approx. 1100mm/1550mm/1450mm, weight: approx. 1250kg. Documentation available. On-site inspection is possible.

SMD Inspector

Saki Spider/BF-Frontier II

Germany

2008

used

on request

INNO29124

Two inspection machines for the semiconductor industry, specifically for PCB production, are available. 1) 3D solder paste inspection system Saki SPI-Spider, year of manufacture: 2007, inspection type: tomography, 2) automatic optical inspection system Saki AOI System BF-Frontier II, year of manufacture: 2008, resolution: 18µm, min. board dimensions X/Y: 60mm/50mm, max. board dimensions X/Y: 500mm/460mm, board warp: +/- 50mm. PCB dimensions X/Y: 500mm/460mm, PCB warp: +/-2mm, component clearance top/bottom: 40mm/40mm, rotation: 359°, transport height: 900mm, transport height adjustment: +/-20mm, machine dimensions X/Y/Z: approx. 850mm/1350mm/1250mm, weight: approx. 450kg. Documentation available. On-site inspection is possible.

Placement System

I-pulse (yamaha) M20

Germany

2012

used

on request

INNO29080

An i-Pulse SMD placement machine with IQ Vision, a subsidiary of Yamaha, is available. PCB thickness range: 0.4mm-4.8mm, min. PCB dimensions X/Y: 50mm/30mm, max. PCB dimensions X/Y: 1480mm/510mm, transport speed: 900mm/s, number of heads: 4, production output: 24000CPH. Placement accuracy CHIP: +/-0.04mm, placement accuracy IC: +/-0.025mm, placement angle: +/-180°, max. component size range: 0402-120mm/90mm, max. component height: 30mm. Machine dimensions X/Y/Z: approx. 1750mm/1750mm/1450mm, weight: approx. 1500kg. Including 3x feeder carriages and 2x tray feeders for installation in the machine. Documentation available. On-site inspection is possible.

Pick and Place System

Dima HP-100

Germany

unknown

used

on request

INNO29019

Cycle time: 1.16s/QFP with Area CCD camera, 0. 85s/chip with Closed Loop Electromechanical Alignment, optimal placement rate: 3125 on IPC 9850 with Area SCC & LCC cameras, 4200 on IPC 9850 with CLEA, nominal placement rate: 2500-3500cph (components per hour), processable component types: 0201-Chip, MELF, SOT, SOIC, TSOP, TNT, PLCC, QFP, BGA, µBGA, LCC, field size: 42x42mm, fine pitch: Up to 0.4mm (16 mil), Tool change station: 12 nozzle positions, Heads: single gantry with two independently controlled pipettes, Assembly accuracy (X/Y) 3σ: 50µ with Area CCD camera,100µ with Closed Loop Electromechanical Alignment, PCB dimensions (X/Y): 30-330x30-450mm, PCB alignment: fiducial detection by ESI CorrectPlace® incl. Teach-in for drill holes or unusual contours, loading and alignment time: approx. 2.8s, number of axes: 2, length: 1700mm, width: 1500mm, height: 2200mm, weight: 450kg without feeder. On-site inspection is possible.

Pick and Place System

Dima Modulo MP-100

Germany

unknown

used

on request

INNO29018

Platinum thickness: 0.5-4.5mm, component height: top max. 16mm, bottom max. 30mm, components: Chip, MELF, SOT, SOIC, TSOP, PLCC, QFP, BGA, LCC, µBGA etc., Incremental axes X: 0.001mm, Y: 0.001mm, Z: 0.02mm, theta: 0.045°, connected load: 2500W, operating temperature: 18-30°C, control: microprocessor control with CAN interface, operated on PC with Windows® 7, vision system: ESI CorePlace®, automatic board alignment, complete component identification, inspection of solder pads, pin positions, component position, BGA ball count etc., weight: 700kg. On-site inspection is possible.

Automated Optical Inspection System

Vi Technology 5K SPECTRO

Germany

unknown

used

on request

INNO29017

Components per hour: 480,000, field of view (FOV) dimensions: 61.1x44.9mm², PCB dimensions: 50-533x50-609mm, PCB thickness: 0.5-4mm, max. PCB weight: 3kg, clamping clearance for PCB clamping: 3mm, component clearance under the camera: 34mm, component clearance under the PCB: 60mm. Length: 1110mm, width: 1351mm, height: 1892mm, weight: 900kg. Without loader and unloader. On-site inspection is possible.

Soldering System

Smt 1.2 TC N2

Germany

unknown

used

on request

INNO28745

A full convection reflow soldering system SMT with nitrogen support is available. Heating zones: 2, heating length: 1080mm, max. process temperature: 300°C, cooling type: air cooling, cooling length: 550mm, heating and stabilization time: 15min, conveyor width: 300mm, conveyor speed: 2m/min, max. component height: 80mm, total output: 15kW, machine dimensions X/Y/Z: approx. 2400mm/1000mm/1450mm. On-site inspection is possible.

Soldering Cabin

Pötter PK-IAT-L 1400

Germany

2011

used

on request

INNO28601

A soldering booth including extraction is available. Documentation available. On-site inspection is possible.

Optical Exposure System

Automatech/altix ZG 357/386

Germany

2004

used

on request

INNO28323

Two Automa-Tech (Altix) exposure machines are available for the PCB industry. 1) ZG 357, running direction: right-left, min. board dimensions X/Y: 530mm/385mm, max. board dimensions X/Y: 630mm/530mm, film dimensions X/Y: 685.8mm/584.2mm, UV burner power: 2x10kW, exposure: double-sided, cameras: 2/side, machine dimensions X/Y/Z: approx. 3650mm/2600mm/2450mm. 2) Contact platesetter ZG 386, min. plate dimensions X/Y/Z: 525mm/351mm/0.5mm, max. plate dimensions X/Y/Z: 635mm/533mm/4.5mm. The machine has a comprehensive and large spare parts package. Numerous spare parts are also available for the ZG series (not this machine). Documentation available. On-site inspection is possible. Individual sale of the machines or spare parts is possible.

Press-in Machine

Tyco P300

Germany

2001

used

on request

INNO28060

A Tyco (TE Connectivity) press-fit machine (insertion machine) is available. Insertion dimensions X/Y: 300mm/310mm, max. speed: 150mm/s, max. number of insertions: 15 million/year, insertion capacity: 4000-5000 pins/h. Machine dimensions X/Y/Z: approx. 2400mm/1600mm/1450mm, weight: approx. 600kg. Documentation available. On-site inspection is possible.

Pick-And-Place Machine

Mechatronika M10V

Germany

2013

used

on request

INNO28008

A Mechatronika pick-and-place machine is available. Placement capacity: 1500/h, max. PCB dimensions X/Y: 300mm/400mm, component range: 0402 to 30mm/30mm, min. connection pitch: 0.5mm. Tape feeders: 8mm/12mm/16mm/24mm/32mm/44mm, max. number of 8mm tape feeders: 32, bar feeders: SO4 to PLCC84, component centering: optical (vision). Tool changer: 8, resolution X/Y: 5µm, angle resolution: 0.045°/step. Machine dimensions X/Y/Z without feeder: approx. 750mm/830mm/550mm, machine dimensions X/Y/Z with all attachments: 1700mm/1000mm/550mm, weight without feeder: approx. 70kg, operating hours: approx. 300h. Including base frame, computer unit, monitor, accessories and VS dosing unit for the fully automatic, program-controlled application of solder paste or adhesive from cartridges (5cm³/10cm³). Documentation available. On-site inspection is possible.

Placement System

Neoden S1

Germany

2019

used

on request

INNO27708

Heads: 4, Feeder slots: 58, Positioning accuracy: +/-0.01mm, Production output: 6000CPH, Camera field of view X/Y at 20µm resolution: 48mm/40mm, Machine dimensions X/Y/Z: approx. 1000mm/760mm/600mm, Weight: approx. 100kg. Documentation available. On-site inspection is possible.

Wave Soldering System

Seho System 8040 PCS

Germany

unknown

used

on request

INNO27642

Soldering volume: approx. 400kg, wave width: 400mm, usable working width: 390mm, max. component height: 100mm, max. PCB length: 562mm, heating power crucible: 9kW, heating time 20°C-250°C/190°C-250°C: 150min/60min, transport speed: 2m/min, power requirement: 18.5kW. Machine dimensions X/Y/Z: approx. 2300mm/850mm/1650mm, empty weight: approx. 450kg. Documentation available.

Reflow Oven

Smt 1.7 TC N2

Germany

2005

used

on request

INNO27641

Text: Heating zones: 7, transport width: 400mm, transport speed: 1500mm/min, nitrogen consumption at 250°C: approx. 15m³/h, nitrogen purity: 99.999%, cooling zones: 2, machine dimensions X/Y/Z: approx. 3300mm/1400mm/1500mm, weight: approx. 2000kg.

Automated Optical Inspection Machine

Göpel Opticon BasicLine NP

Germany

2009

used

on request

INNO27266

Resolution X/Y (3D and 2D): 21μm/10.5μm, illumination: multispectral, multidirectional, component clearance above/below PCB: 40mm/100mm, max. inspection speed: 50cm²/s, inspection range X/Y: 450mm/350mm. Dimensions X/Y/Z: approx. 1150mm/1150mm/1450mm, weight: approx. 500kg, software: OptiCon Pilot 5.3. Including calibration tool, instructions, camera, lighting and repair software for error visualization. Computer was replaced in 2012. Documentation available.

SMT Feeder

Feeder Rüttelfeeder/8mm-44mm

Germany

unknown

used

on request

INNO27262

Various SMT feeders are available. 12x vibratory feeders, 189x 8mm feeders, 21x 12mm feeders, 13x 16mm feeders, 12x 24mm feeders, 8x 32mm feeders, 3x 44mm feeders and 10x feeder carriages.