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Innovac GmbH Used machines from Germany

i.e. Machining Center MORI SEIKI

All Offers / Automation technology / Placement technology

Assembly systems 5 Manipulators 7 Other machinery 7 Placement technology 37 Positioning systems 1 Sorting device 3 Steerings 3 Switchgears and controlgears 1

Innovac used-machines

Placement technology [1 - 20 of 37]

Pick-and-Place Line

Juki KE-3020/ FX3

Germany

unknown

used

on request

INNO32255

The line consists of one Juki KE-3020L pick-and-place machine, one Juki FX-3 pick-and-place machine, one Kurtz Ersa HOTFLOW 2/12 reflow soldering oven and one Kurtz Ersa stencil printer, 1) Juki KE-3020L pick-and-place machine, 2) Juki FX-3 pick-and-place machine, placement speed - optimum: 0.049s/chip (74,000CPH), placement speed - IPC9850: 60,000CPH, component size: 0402 (01005) to 33.5mm (or diagonal length up to 47mm), placement accuracy: +/-0.05mm (Cpk ≥ 1), max. feeder inputs: 120 with 8mm tape feeders, max. PCB size: 50-410x50-360mm, length: 1650mm, width: 2650mm, height: 1530mm, weight: 3.28t, 3) Kurtz Ersa HOTFLOW 2/12 reflow soldering oven, conveyor system working width: 50-500mm, working width with PCB center support: 60-500mm, PCB clearance: +35/-20mm, conveyor speed: 20-200cm/min, conveyor height above floor: 820-950mm, pin and chain conveyor: 5mm edge clearance, cooling zone: water recooling system, 2 upper cooling modules, cooling medium: water / air, ambient temperature: 10-35°C, process length: 2450mm, heating zone: 1650mm, cooling zone: 800mm, inlet zone: 700mm, outlet zone: 700mm, process chamber width: 700mm, length: 3890mm, width: 1390mm, height: 1370-1500mm, weight: 1.4t, 4) Kurtz Ersa stencil printer. An on-site inspection is possible.

Pick-and-Place Line

Juki KE-2070/ KE-2080

Germany

unknown

used

on request

INNO32252

The line consists of one Juki KE-2070 pick-and-place machine, one Juki KE-2080 pick-and-place machine, one Juki RS-800 reflow soldering oven and a cooling unit (chiller), 1) Juki KE-2070 pick-and-place machine, permissible component height SC: 6mm, NC: 12mm, PCB dimensions Medium: 330x250mm, Large: 410x360mm, Extra Large: 510x460mm, transport direction: right-to-left or left-to-right, transport height: 900mm +/-20mm, 950mm +/-20mm, 2) Juki KE-2080 pick-and-place machine, permissible component height NC: 12mm, HC: 20mm, EC: 25mm, PCB dimensions Medium: 330x250mm, Large: 410x360mm, Extra Large: 510x460mm, transport direction: right-to-left or left-to-right, transport height: 900mm +/-20mm, 950mm +/-20mm, 3) Juki RS-800 8-zone reflow soldering oven, number of heating zones: top 8, bottom 8, heating zone length: 3121mm, number of cooling zones: top 2, cooling zone length: 800mm, exhaust air volume: 10m³/min x2 exhaust connections, heat-up time: approx. 25min, temperature setting range: room temperature to 300°C, temperature control: closed-loop PID control + SSR, PCB width: 50-450mm, transport height: 950mm +/-20mm, transport speed: 300-2000mm/min, chain lubrication: automatic lubrication, cooling method: forced-air cooling, connected load: 64kW, power consumption during start-up: approx. 35kW, power consumption during normal operation: approx. 8.5kW, length: 5314mm, width: 1417mm, height: 1524mm, weight: 2.25t, 4) Cooling unit (chiller). An on-site inspection is possible.

Stencil Printer

Ekra X5-Prof

Germany

2011

used

on request

INNO32149

Offered is a fully automatic EKRA screen and stencil printing system. Max. print format X/Y: 508mm/508mm, min. print format X/Y: 80mm/50mm, max. frame size X/Y: 740mm/740mm, substrate thickness range: 0.5mm-6mm, max. squeegee speed: 200mm/s, squeegee pressure range: 10N-250N, repeatability: +/-12.5µm, 6 Sigma, cycle time: 8s + printing time. Including solder paste height inspection, 2.5D SPI and fixtures for VarioGrid support bars as well as iPAG dispensing system. The machine was serviced in April 2025. Machine dimensions X/Y/Z: approx. 1140mm/1866mm/1503mm, weight: 980kg. Documentation available. Inspection possible by appointment.

Etching Machine

Pill Export 650

Germany

2009

used

on request

INNO32026

Industrial Pill etching machine from a printed circuit board manufacturing facility. Process stages: infeed section, etching chamber, replenisher, 4-stage cascade rinse, drying and outfeed section, max. working width: 650mm, PCB thickness: 0.1mm-3.2mm, conveyor speed: 0.5m/min-5.0m/min, max. process temperature: 55°C. Including a magnetic centrifugal pump for the etching chamber, one tank X/Y: 3500mm/2200mm and one Lantronic stacker. Machine dimensions X/Y/Z: approx. 3400mm/2000mm/1300mm. An on-site inspection is possible.

Etching machine

Pill Export 550

Germany

1989

used

on request

INNO32025

An industrial etching machine from a printed circuit board manufacturing facility for the alkaline development of photoresists is offered. Process sequence: infeed, etch chamber, replenisher, 3-stage rinse, drying and outfeed, max. working width: 550mm, printed circuit board thickness range: 0.2mm-4.0mm, conveyor speed: 0.4m/min-2.5m/min. Including a Nubal unstacker, a drip tray X/Y: 3900mm/1600mm and a 200l dosing unit with agitator. Machine dimensions X/Y/Z: approx. 4000mm/1300mm/1400mm. An on-site inspection is possible.

Etching Machine

Pill Export 650

Germany

2008

used

on request

INNO32024

An industrial Pill micro-etching machine for the micro-etching of printed circuit boards (PCBs) from a PCB manufacturing facility. is offered. Process steps: infeed, micro-etching, rinsing, drying and outfeed, max. working width: 650mm, PCB thickness range: 0.1mm-3.2mm, feed speed: 0.5m/min-3.5m/min, machine dimensions X/Y/Z: approx. 2600mm/1400mm/1300mm. Including a Dataco stacking unit. Documentation available. On-site inspection is possible.

Stencil Printer

Ekra X5 Prof

Germany

2012

used

on request

INNO31985

Two identical Ekra stencil printers, both fully overhauled in 2026, are available. Year of manufacture: 2009/2012, overhaul: 2026/2026, min. printing area X/Y: 80mm/50mm, max. printing area X/Y: 508mm/508mm, substrate thickness range: 0.5mm-6mm, max. substrate weight: 2kg, min. stencil dimensions X/Y: 450mm/450mm, max. stencil dimensions X/Y: 740mm/740mm, repeat accuracy at 6 Sigma: +/-12.5µm, squeegee speed: 200mm/s, squeegee pressure: 10kN-250kN, snap-off min./max.: -1.5mm/6mm, separation distance: 0mm-3mm, separation speed: 100mm/s, transport height range: 830mm-950mm, machine dimensions X/Y/Z: approx. 1150mm/1900mm/1550mm, weight: approx. 750kg. Including operator computer, steel squeegees, accessories, EVA Vision System and automatic stencil cleaner. Documentation available. On-site inspection is possible.

Placement System

Mycronic MY200LX-10

Germany

2017

used

on request

INNO31969

Offered for sale is a Mycronic SMT placement machine. Max. placement capacity: 16000components/h, IPC net throughput: 13800components/h, placement system: HYDRA, placement tools: 8, max. component dimensions X/Y/Z: 56mm/56mm/15mm, max. component weight: 140g, min. PCB size X/Y: 70mm/50mm, max. PCB size with T3 X/Y: 443mm/508mm, min./max. PCB thickness: 0.4mm/6mm, max. PCB weight with T3: 5kg, feeder capacity with T3: 112 × 8mm feeder positions, conveyor height range: 880mm-975mm, operating hours: approx. 6871h, placement time: approx. 2983h. Machine dimensions X/Y/Z: approx. 2690mm/2229mm/1446mm, weight: approx. 1400kg. Inspection possible by appointment.

Vapour Phase Soldering System

Ibl SLC504

Germany

2005

used

on request

INNO31857

A vapor phase soldering system IBL is offered for processing SMT printed circuit boards and electronic assemblies. Soldering format X/Y: approx. 530mm/330mm, max. printed circuit board format: 540mm/307mm/50mm, medium filling: approx. 15kg, water connection: 1/2 inch, min./max. water pressure: approx. 2.5bar/4bar. Dimensions: approx. 1190mm/1760mm/1320mm, weight: approx. 500kg. Inspection by appointment possible.

Soldering Oven

Wmu Fibex Combi M-20/40/375-94E

Germany

2017

used

on request

INNO31826

A WMU projection brazing furnace, originally built in 1997, but completely refurbished and overhauled in 2017, is available. Heated length: 3750mm, max. operating temperature: 1150°C, heating zones: 4, heating elements: CRFeAl grade, heating capacity: 94kW, usable width: 400mm, usable height: 200mm, throughput: approx. 200kg/h, speed min./max.: 100mm/400mm/min, overall system dimensions X/Y/Z: approx. 19600mm/1900mm/3000mm, control system: PLC. Including an additional muffle, heating elements, conveyor belt and cooling segments. Documentation available. An on-site inspection is possible.

CNC PCB Drilling and Milling Machine

Pluritec Multistation V3

Germany

1998

used

on request

INNO31797

A CNC PCB drilling and milling machine for PCB manufacturing is available. Stations: 2, Speed: 125000rpm, Collet: 3.175mm, Tool diameter range: 0.1mm-6.35mm, Working dimensions X/Y: 630mm/765mm, Positioning accuracy: 5µm, Repeatability: 4µm, Rapid traverse: 25m/min. Documentation available. An on-site inspection is possible.

Placement System

Mimot Advantage MP 1260.2-27

Germany

2004

used

on request

INNO31683

An Mimot SMD placement machine is available. Infeed height: 888mm, max. component dimensions X/Y: 55mm/55mm, max. component height: 10mm, placement accuracy at Sigma 4: 35µm, repeatability at Sigma 4: 10µm, angular accuracy at Sigma 4: 0.07°, placement rate according to IPC: approx. 14400components/h, min. PCB dimensions X/Y: 50mm/500mm, max. PCB dimensions X/Y: 380mm/400mm, PCB thickness range: 0.5mm-4mm, maintenance: 02/2025. Machine dimensions X/Y: approx. 3100mm/1100mm, weight: approx. 1850kg. Including an extensive feeder package. Documentation available. An on-site inspection is possible.

Flying Probe Test System

Seica Pilot V8 Auto-SW-001

Germany

2019

used

on request

INNO31426

A Flying Probe Tester Seica Pilot V8 Next Series with inline handling module on the left for vertical tilting of the PCB and inline handling module on the right for horizontal tilting and rotating of the PCB is available. Flying Probe Test System Seica Pilot V8 Next Series: PCB clamping system: manual, double-acting, manual active test area: 538x610mm, active test area: 518x610mm, PCB dimensions: 540x610mm, min. PCB size: 20x20mm, PCB thickness: 0.3 to 5mm, max. component height: 37mm, PCB loading: vertical, UUT edge clearance manual/automatic: 2/6mm, length: 1750mm, width: 1030mm, height: 1995mm, weight: 1.4t. Test tools/techniques: FNODE signature analysis on the nets of the unit under test, standard analog and digital in-circuit test, vectorless tests, JSCAN and OPENFIX to test ICs for opens and shorts, PWMON net analysis with power-on of the assembly, continuity tests to detect open connections on the assembly, visual tests for detecting component presence, component absence and rotation, high-resolution color camera, optional functional tests and boundary scan test capabilities, optional on-board programming tools for digital components, with complete documentation. An inspection on site is possible.

Stencil Printer

Ekra MAT S 40

Germany

1989

used

on request

INNO30882

A stencil screen printing machine Ekra is available. Frame dimensions X/Y: 800mm/570mm, print dimensions X/Y: 500mm/390mm, print speed: 110mm/s, positioning accuracy: +/-0.02mm, squeegee pressure: 320N, table adjustment X/Y: +/-8mm, max. print material thickness: 40mm, machine dimensions X/Y/Z: approx. 1300mm/1050mm/1350mm, weight: approx. 350kg. Documentation available. An on-site inspection is possible.

Automatic SMD Component Placement System

Essemtec FLX2011-LV

Germany

2008

used

on request

INNO30875

Positioning resolution: 1µm, max. placement rate: 6000cp/h, max. feeder capacity: 310, min. PCB dimensions X/Y: 50mm/50mm, max. PCB dimensions X/Y: 780mm/600mm, PCB thickness range: 0.5mm-3.5mm. Documentation available. An on-site inspection is possible.

Fully Automatic Screen Printer

Dek Horizon 03iX

Germany

2011

used

on request

INNO30866

An inline SMT stencil printer/solder paste printer is offered. Print area X/Y: 50mm/40.5mm - 510mm/508.5mm, PCB thickness: 0.2mm - 6mm, board weight max.: approx. 1kg, print pressure range: 0 - 20kg, core cycle time: approx. 12s, machine alignment capability: greater 2Cpk at +/-12.5µm 6 Sigma, process/wet print accuracy: greater 2Cpk at +/-25µm 6 Sigma, installation space L/W/H: approx. 2060mm/1500mm/1570mm, machine weight: approx. 800kg. Inspection by arrangement possible.

Soldering System

Dr. Fritsch SLM 523

Germany

1997

used

on request

INNO30467

A Dr. Fritsch segment soldering machine for the automatic soldering of segments (typically diamond segments) onto carrier tools is available. An on-site inspection is possible.

Optical Inspection Machine

Göpel OptiCon Basic Line X30

Germany

2009

used

on request

INNO18578

Software: OptiCon Pilot 5.1, with documentation, camera and lighting module, 3x repair work place software for defect visualisation and 4GB RAM computer, was last maintained in 2013.

Stencil Printer

Tws Automation SR3100

Germany

2010

used

on request

INNO30396

Offered are 2 fully automatic stand-alone stencil printers for SMD assembly technology, PCB assembly year 2010. Fully automatic vision system, Linux-based operating software, double loading system, motorized table drive, large printing area X/Y 440mm/440mm, frame size X/Y max. 670mm/700mm, PCB thickness max. 6mm, cycle time approx. 18-25 sec., product changeover time < 5 min., squeegee pressure 4-24kg programmable, snap-off/separation speed programmable, compressed air supply 6bar approx. 60l/min., dimensions X/Y/Z 2080mm/1130mm/1450mm, signal tower 2000mm, weight approx. 285kg. Inspection possible by appointment.

Stencil Printer

Dek 265 GSX

Germany

1998

used

on request

INNO30222

Two identical DEK stencil printers are available. Printing speed: 150mm/s, max. printing dimensions X/Y: 510mm/489mm, max. stencil dimensions X/Y: 510mm/508mm, min. stencil dimensions X/Y: 71mm/38mm, max. product thickness: 6mm. Machine dimensions X/Y/Z: approx. 1350mm/1400mm/1500mm, weight: approx. 800kg. Documentation available. An on-site inspection is possible.